Substrate treating apparatus

ABSTRACT

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 12/163,951, which claims priority to Japanese Patent Application No. 2007-172496, filed Jun. 29, 2007. The disclosures of both of these applications are hereby incorporated by reference in their entirety for all purposes.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates to a substrate treating apparatus for performing a series of treatments of substrates such as semiconductor wafers, glass substrates for liquid crystal displays, glass substrates for photomasks, and substrates for optical disks (hereinafter called simply “substrates”).

(2) Description of the Related Art

Conventionally, a substrate treating apparatus is used to form a resist film on substrates, allows the substrates having the resist film formed thereon to be exposed in a separate exposing machine, and develops the exposed substrates. Specifically, the substrate treating apparatus includes a plurality of blocks each having various chemical treating units such as coating units for forming resist film and heat-treating units arranged with a single main transport mechanism. This apparatus transports substrates to each block to be treated therein (as disclosed in Japanese Unexamined Patent Publication No. 2003-324139, for example).

The conventional apparatus with such a construction has the following drawback.

In the conventional apparatus, the main transport mechanism goes through five to 10 transporting steps for treating each substrate in its block, and each transporting step takes several seconds. Supposing that the number of transporting steps is six and each step takes five seconds, the throughput in the block can be raised up to 30 seconds per substrate (or 120 substrates per hour). However, there is not much room for reducing the number of transporting steps for the single main transport mechanism or shortening the time for each transporting step. Hence, it is difficult to achieve a further improvement in throughput of each block. It is therefore difficult to improve the throughput of the entire apparatus. One possible solution is to employ multiple main transport mechanisms. However, an increase in the number of main transport mechanisms in each block entails the inconvenience of increasing the chemical treating units and heating units, thereby enlarging the footprint.

SUMMARY OF THE INVENTION

One of the objectives of this invention is to provide a substrate treating apparatus that can improve throughput without enlarging the footprint of the substrate treating apparatus.

In one embodiment, a substrate treating apparatus comprising a plurality of substrate treatment lines each including a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each of the main transport mechanisms for treating substrates; each of the substrate treatment lines carrying out a series of treatments of the substrates, with each of the main transport mechanisms transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto; wherein the substrate treatment lines are arranged vertically.

According to this embodiment, the plurality of substrate treatment lines are arranged vertically, so that the substrates are treated in parallel through the respective substrate treatment lines. This realizes an increased throughput of the substrate treating apparatus. Since the substrate treatment lines are arranged vertically, an increase in the installation area of the substrate treating apparatus can be avoided.

The horizontal arrangement of the main transport mechanisms is arbitrary. For example, the main transport mechanisms may be arranged in one row or a plurality of rows extending in one direction. The main transport mechanisms may be arranged at different points on an imaginary curve, or may be arranged in a zigzag pattern. The arrangement of the treating units associated with each main transport mechanism is also arbitrary. The treating units may be arranged horizontally, stacked vertically, or arranged crisscross in a matrix form.

In an alternate embodiment, the main transport mechanisms and the treating units in the respective substrate treatment lines may be in substantially the same arrangement in plan view. One of the benefits realized by this arrangement is that the apparatus construction can be simplified.

The substrate treating apparatus may further comprise gas supply openings for supplying a gas into transporting spaces where the main transport mechanisms are installed, and gas exhaust openings for exhausting the gas from the transporting spaces. This provides the benefit of maintaining the transportation areas substantially free from particulate matter.

In addition, the area of the transporting spaces for each substrate treatment line may be blocked off and separate gas supply openings and gas exhaust openings can be provided for each substrate treatment line. This will result in even cleaner transporting spaces.

The gas supply openings may be formed in a blowout unit and the gas exhaust openings formed in an exhaust unit with at least one of the gas blowout unit and the gas exhaust unit blocking off atmosphere for each of the substrate treatment lines. This realizes a simplified apparatus construction.

The gas supply openings may be arranged in a position higher than the gas exhaust openings further reducing possibility of particulate contamination.

The gas supply openings may be arranged over the transporting spaces, and the gas exhaust openings under the transporting spaces. This arrangement results in downward gas currents and helps to keep the transporting spaces cleaner.

In still another embodiment, the apparatus may further comprise an indexer's transport mechanism for transporting the substrates to and from a cassette for storing a plurality of substrates, wherein the indexer's transport mechanism transfers the substrates to and from an end transport mechanism which is one of the main transport mechanisms located in one end region of each of the substrate treatment lines, the indexer's transport mechanism transferring the substrates to and from an upper one of the end transport mechanisms at a height adjacent a lower portion of the upper one of the end transport mechanisms, and transferring the substrates to and from a lower one of the end transport mechanisms at a height adjacent an upper portion of the lower one of the end transport mechanisms. Since the upper and lower substrate transfer positions are close to each other, the indexer's transport mechanism moves a reduced amount vertically. This improves the operating efficiency of the indexer's transport mechanism.

The apparatus may further comprise a receiver provided between the indexer's transport mechanism and each end transport mechanism for receiving the substrates, the indexer's transport mechanism transferring the substrates through the receiver. The transfer of substrates through the receiver can improve the transporting efficiency over the case of transferring the substrates directly between the transport mechanisms.

In yet another embodiment, a substrate treating apparatus comprises a plurality of treating blocks arranged horizontally, each including treating units arranged on each of upper and lower stories, and a main transport mechanism provided for each of the stories for transporting substrates to the treating units on each of the stories; wherein a series of treatments is performed for the substrates by transferring the substrates between the main transport mechanisms of the treating blocks adjacent each other on the same story.

According to this embodiment, substrates are transported to and from the plurality of treating blocks arranged horizontally, and in parallel through the different stories. A series of treatments are performed on the substrates in parallel on the respective stories, each having the plurality of treating blocks. This realizes an increased throughput of the substrate treating apparatus. Since the treating blocks have a layered structure with a plurality of stories arranged vertically, an increase in the installation area of the substrate treating apparatus can be avoided.

In the embodiment noted above, each of the treating blocks may have a housing for collectively accommodating the treating units and the main transport mechanisms included in each of the treating blocks. Then, each treating block can be handled as a unit, thereby simplifying the manufacture and repair of the substrate treating apparatus.

Each of the treating blocks may further include a shielding plate disposed between the respective stories, gas supply openings for supplying a clean gas into a transporting space of the main transport mechanism on each story, and gas exhaust openings for exhausting the gas from the transporting space of the main transport mechanism on each story. This construction can prevent any particles generated by each main transport mechanism from reaching the other story. The transporting space on each story can also be kept clean.

In the above construction, the gas supply openings may be formed in a blowout unit, and the gas exhaust openings in an exhaust unit, at least one of the gas blowout unit and the gas exhaust unit acting as the shielding plate. This simplifies the apparatus construction.

The gas supply openings of each transporting space may be arranged in a position higher than the gas exhaust openings of the transporting space. Then, the air currents in each transporting space form a down-flow, which can keep the transporting space even cleaner.

The apparatus may further comprise an indexer's transport mechanism for transporting the substrates to and from a cassette for storing a plurality of substrates, and for transporting the substrates to the main transport mechanisms on the respective stories of an end one of the treating blocks, wherein the indexer's transport mechanism transfers the substrates, in positions adjacent each other, to and from the main transport mechanisms on the respective stories of the end one of the treating blocks. This enables the indexer's transport mechanism to perform reduced amount of vertical movement, thereby improving the operating efficiency of the indexer's transport mechanism.

The above construction may further comprise substrate receivers provided between the main transport mechanisms on the respective stories of the end one of the treating blocks and the indexer's transport mechanism, the indexer's transport mechanism transferring the substrates through each of the receivers. This construction realizes an improved transporting efficiency compared to transferring the substrates directly between the transport mechanisms.

In a still another embodiment, a substrate treating apparatus comprises an indexer section including an indexer's transport mechanism for transporting substrates to and from a cassette for storing a plurality of substrates; a coating block disposed adjacent the indexer section, and including coating units and heat-treating units arranged on each of upper and lower stories for forming resist film on the substrates, and a main transport mechanism disposed on each story for transporting the substrates to and from the coating units and the heat-treating units on the each story; a developing block disposed adjacent the coating block, and including developing units and heat-treating units arranged on each of upper and lower stories for developing the substrates, and a main transport mechanism disposed on each story for transporting the substrates to and from the developing units and the heat-treating units on the each story; and an interface section disposed adjacent the developing block, and including an interface's transport mechanism for transporting the substrates to and from an exposing machine provided separately from the apparatus; wherein the indexer's transport mechanism transfers the substrates to and from the main transport mechanism on each story of the coating block; the main transport mechanism on each story of the coating block transfers the substrates to and from the main transport mechanism on the same story of the developing block; and the interface's transport mechanism transfers the substrates to and from the main transport mechanism on each story of the developing block.

According to this embodiment, the indexer's transport mechanism takes the substrates out of the cassette in order, and transfers these substrates to the main transport mechanisms on the respective stories of the coating block. Each main transport mechanism of the coating block transports the substrates to the associated coating units and heat-treating units. Each treatment unit carries out a predetermined treatment of the substrates. The main transport mechanism on each story of the coating block transfers the substrates having resist film formed thereon to the main transport mechanism on the same story of the adjoining developing block. Each main transport mechanism of the developing block transfers the substrates to the interface's transport mechanism of the adjoining interface section. The interface's transport mechanism transfers the received substrates to the exposing machine, which is an external apparatus. The exposed substrates are returned to the interface section again. The interface section's transport mechanism transfers the substrates to the main transport mechanism on each story of the developing block. Each main transport mechanism of the developing block transports the substrates to the associated developing units and heat-treating units. Each treating unit carries out a predetermined treatment of the substrates. The main transport mechanism on each story of the developing block transfers the developed substrates the main transport mechanism on the same story of the adjoining coating block. The main transport mechanism on each story of the coating block transfers the substrates to the indexer's transport mechanism of the indexer section. The indexer's transport mechanism stores the substrates in a predetermined cassette. According to this construction, as described above, the coating block and developing block carry out the resist film forming treatment and developing treatment in parallel on each story. This construction, therefore, increases the treating efficiency of the substrate treating apparatus. Since the coating block and developing block have a layered structure with a plurality of stories arranged vertically, an increase in the footprint can be avoided.

The apparatus may further comprise a controller for controlling the interface's transport mechanism to transport the substrates to the exposing machine in an order in which the indexer's transport mechanism has taken the substrates out of the cassette. This helps with tracking multiple substrates within the apparatus.

The interface section may further include a plurality of buffers to temporarily store the substrates. The controller being arranged to control the interface's transport mechanism, when the substrates are delivered from the developing block in an order different from the order in which the indexer's transport mechanism has taken the substrates out of the cassette, to receive the substrates and transport the substrates to the buffers. The substrates are transferred to the buffers in the event that the substrates are delivered from the developing block in an order different from the order in which the indexer's transport mechanism initially took the substrates out of the cassette. This allows the developing block to deliver succeeding substrates. Further, the order of transporting the substrates from the interface section to the exposing machine may be adjusted to the order in which the indexer's transport mechanism has taken the substrates out of the cassette. Thus, the substrates can be treated conveniently in a predetermined order.

The coating units for forming resist film on the substrates may include a resist film coating unit for applying a resist film material to the substrates, and an anti-reflection film coating unit for applying an anti-reflection film forming solution to the substrates.

This specification discloses several embodiments directed to the following substrate treating apparatus:

(1) A substrate treating apparatus is provided wherein the series of treatments carried out in each of the substrate treatment lines is the same.

According to the embodiment defined in (1) above, the apparatus construction can be simplified.

(2) A substrate treating apparatus is provided wherein said treating units include solution treating units for treating the substrates with a solution, and heat-treating units for heat-treating the substrates.

(3) A substrate treating apparatus is provided in another embodiment wherein said treating units include solution treating units for treating the substrates with a solution, and heat-treating units for heat-treating the substrates.

According to the embodiment defined in (2) and (3) above, various treatments can be carried out for the substrates.

(4) A substrate treating apparatus is provided further comprising a single, second gas supply pipe for supplying a clean gas to each of the treating units associated with the respective main transport mechanisms arranged vertically.

According to the embodiment defined in (4) above, the installation area can be reduced.

(5) A substrate treating apparatus is provided in which the main transport mechanisms on the respective stories of each treating block are arranged in the same position in plan view.

According to the embodiment defined in (5) above, the apparatus construction can be simplified.

(6) A substrate treating apparatus is provided in which the treating units arranged vertically of each treating block perform the same treatment.

According to the embodiment defined in (6) above, the apparatus construction can be simplified.

(7) A substrate treating apparatus is provided further comprising a single, second gas supply pipe for supplying a clean gas to the treating units arranged vertically.

According to the embodiment defined in (7) above, the installation area can be reduced.

(8) A substrate treating apparatus is provided wherein the treating units on each story are stacked.

According to the embodiment defined in (8) above, the apparatus construction can be simplified.

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustrating the invention, there are shown in the drawings several forms which are presently preferred, it being understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown.

FIG. 1 is a plan view showing an outline of a substrate treating apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic side view showing an arrangement of treating units included in the substrate treating apparatus;

FIG. 3 is a schematic side view showing an arrangement of treating units included in the substrate treating apparatus;

FIG. 4 is a view in vertical section taken on line a-a of FIG. 1;

FIG. 5 is a view in vertical section taken on line b-b of FIG. 1;

FIG. 6 is a view in vertical section taken on line c-c of FIG. 1;

FIG. 7 is a view in vertical section taken on line d-d of FIG. 1;

FIG. 8A is a plan view of coating units;

FIG. 8B is a sectional view of a coating unit,

FIG. 9 is a perspective view of a main transport mechanism;

FIG. 10 is a control block diagram of the substrate treating apparatus according to an embodiment of the present invention;

FIG. 11 is a flow chart of a series of treatments of wafers W; and

FIG. 12 is a view schematically showing operations repeated by each transport mechanism.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

Embodiments of this invention will be described in detail hereinafter with reference to the drawings.

FIG. 1 is a plan view showing an outline of a substrate treating apparatus according to an embodiment of the present invention. FIGS. 2 and 3 are schematic side views showing an arrangement of treating units included in the substrate treating apparatus. FIGS. 4 through 7 are views in vertical section taken on lines a-a, b-b, c-c and d-d of FIG. 1, respectively.

This embodiment provides a substrate treating apparatus for forming resist film on substrates (e.g. semiconductor wafers) W, and developing exposed wafers or substrates W. This apparatus is divided into an indexer section (hereinafter called “ID section”) 1, a treating section 3, and an interface section (hereinafter called “IF section”) 5. The ID section 1 and IF section 5 are arranged adjacent to and on the opposite sides of the treating section 3. An exposing machine EXP which is an external apparatus separate from this apparatus is disposed adjacent to the IF section 5.

The ID section 1 takes wafers W out of each cassette C, which stores a plurality of wafers W, and deposits wafers W in the cassette C. The ID section 1 has a cassette table 9 for receiving cassettes C and an ID's transport mechanism T_(ID) for transporting wafers W to and from each cassette C. The ID's transport mechanism T_(ID) corresponds to the indexer's transport mechanism in this embodiment.

The treating section 3 includes four main transport mechanisms T₁, T₂, T₃ and T₄. The treating section 3 is divided into a first to a fourth cells 11, 12, 13 and 14 associated with the respective main transport mechanisms T₁, T₂, T₃ and T₄. The first and third cells 11 and 13 are used for forming resist film on the wafers W. The second and fourth cells 12 and 14 are used for developing the wafers W. Each of the cells 11-14 has a plurality of treating units (to be described hereinafter). The main transport mechanisms T₁, T₂, T₃ and T₄ transport the wafers W to and from the treating units of the respective cells 11-14.

The first and second cells 11 and 12 juxtaposed horizontally are connected to each other to form a substrate treatment line Lu extending between the ID section 1 and IF section 5. The third and fourth cells 13 and 14 juxtaposed horizontally are also connected to each other to form a substrate treatment line Ld extending between the ID section 1 and IF section 5. These two substrate treatment lines Lu and Ld are arranged one over the other. In other words, the treating section 3 has a layered structure with the plurality of substrate treatment lines Lu and Ld arranged vertically.

The substrate treatment lines Lu and Ld are arranged one over the other to adjoin each other. That is, the first cell 11 is located over the third cell 13, and the second cell 12 over the fourth cell 14. Therefore, the treating section 3 may be constructed easily by horizontally arranging a treating block Ba having the first and third cells 11 and 13 formed integrally, and a treating block Bb having the second and fourth cells 12 and 14 formed integrally.

The IF section 5 transfers wafers W to and from the exposing machine EXP. The IF section 5 has IF's transport mechanisms T_(IF) for transporting wafers W. The IF's transport mechanisms T_(IF) include a first transport mechanism T_(IFA) and a second transport mechanism T_(IFB). The first transport mechanism T_(IFA) and second transport mechanism T_(IFB) correspond to the interface's transport mechanisms in this embodiment.

The ID's transport mechanism T_(ID) transfers wafers W to and from the main transport mechanisms T₁ and T₃ of the first and third cells 11 and 13 located adjacent the ID section 1. The main transport mechanisms T₁-T₄ of the cells 11-14 transfer wafers W to and from the other cells connected thereto on the same stories. The IF's transport mechanisms T_(IF) transfer wafers W to and from the main transport mechanisms T₂ and T₄ of the second and fourth cells 12 and 14 located adjacent the IF section 5. As a result, wafers W are transported between the ID section 1 and IF section 5 in parallel through the two substrate treatment lines Lu and Ld, to undergo a series of treatments in each of the substrate treatment lines Lu and Ld. The main transport mechanisms T₁ and T₃ correspond to the end transport mechanisms in this embodiment.

This apparatus includes receivers PASS₁ and PASS₃ for transferring wafers W between the ID's transport mechanism T_(ID) and main transport mechanisms T₁ and T₃. Similarly, a receiver PASS₂ is provided for transferring wafers W between the main transport mechanisms T₁ and T₂, and a receiver PASS₄ for transferring wafers W between the main transport mechanisms T₃ and T₄. Further, receivers PASS₅ and PASS₆ are provided for transferring wafers W between the main transport mechanisms T₂ and T₄ and IF's transport mechanisms T_(IF). Each of the receivers PASS₁-PASS₆ has a plurality of support pins projecting therefrom, for receiving a wafer W in a substantially horizontal position on these support pins.

[ID Section 1]

The ID section 1 will be described next. The cassette table 9 can receive four cassettes C arranged in a row. The ID's transport mechanism T_(ID) has a movable base 21 for moving horizontally alongside the cassette table 9 in the direction of arrangement of the cassettes C, a lift shaft 23 vertically extendible and contractible relative to the movable base 21, and a holding arm 25 swivelable on the lift shaft 23, and extendible and retractable radially of the swivel motion, for holding a wafer W. The ID's transport mechanism TID can transport wafers W between each cassette C and the receivers PASS₁ and PASS₃.

[First Cell 11]

A belt-like transporting space Al for transporting wafers W extends through the center of the first cell 11 and parallel to the direction of arrangement of the first and second cells 11 and 12. The treating units of the first cell 11 are coating units 31 for applying a treating solution to the wafers W, and heat-treating units 41 for heat-treating the wafers W. The coating units 31 are arranged on one side of the transporting space A₁, while the heat-treating units 41 are arranged on the other side thereof.

The coating units 31 are arranged vertically and horizontally, each facing the transporting space A₁. In this embodiment, four coating units 31 in total are arranged in two columns and two rows. The coating units 31 include anti-reflection film coating units BARC for forming anti-reflection film on the wafers W, and resist film coating units RESIST for forming resist film on the wafers W. The coating units 31 correspond to the solution treating units in this embodiment.

Reference is made to FIGS. 8A and 8B. FIG. 8A is a plan view of the coating units 31. FIG. 8B is a sectional view of a coating unit 31. Each coating unit 31 includes a spin holder 32 for holding and spinning a wafer W, a cup 33 surrounding the wafer W, and a supply device 34 for supplying a treating solution to the wafer W. The two sets of spin holders 32 and cups 33 at each level are juxtaposed with no partition wall or the like in between. The supply device 34 includes a plurality of nozzles 35, a gripper 36 for gripping one of the nozzles 35, and a nozzle moving mechanism 37 for moving the gripper 36 to move one of the nozzles 35 between a treating position above the wafer W and a standby position away from above the wafer W. Each nozzle 35 has one end of a treating solution pipe 38 connected thereto. The treating solution pipe 38 is arranged movable to permit movement of the nozzle 35 between the standby position and treating position. The other end of each treating solution pipe 38 is connected to a treating solution source (not shown). Specifically, in the case of antireflection film coating units BARC, the treating solution sources supply different types of treating solution for antireflection film to the respective nozzles 35. In the case of resist film coating units RESIST, the treating solution sources supply different types of resist film material to the respective nozzles 35.

The nozzle moving mechanism 37 has first guide rails 37 a and a second guide rail 37 b. The first guide rails 37 a are arranged parallel to each other and outwardly of the two cups 33 arranged sideways. The second guide rail 37 b is slidably supported by the two first guide rails 37 a and disposed above the two cups 33. The gripper 36 is slidably supported by the second guide rail 37 b. The first guide rails 37 a and second guide rail 37 b take guiding action substantially horizontally and in directions substantially perpendicular to each other. The nozzle moving mechanism 37 further includes drive members (not shown) for sliding the second guide rail 37 b, and sliding the gripper 36. The drive members are operable to move the nozzle 35 gripped by the gripper 36 to the treating positions above the two spin holders 32.

Referring back to FIG. 1 and FIG. 3, the plurality of heat-treating units 41 are arranged vertically and horizontally, each facing the transporting space A1. In this embodiment, three heat-treating units 41 can be arranged horizontally, and five heat-treating units 41 can be stacked vertically. Each heat-treating unit 41 has a plate 43 for receiving a wafer W. The heat-treating units 41 include cooling units CP for cooling wafers W, heating and cooling units PHP for carrying out heating and cooling treatments continually, and adhesion units AHL for heat-treating wafers W in an atmosphere of hexamethyl silazane (HMDS) vapor in order to promote adhesion of coating film to the wafers W. As shown in FIG. 5, each heating and cooling unit PHP has two plates 43, and a local transport mechanism (not shown) for moving a wafer W between the two plates 43. The various types of heat-treating units CP, PHP and AHL are arranged in appropriate positions.

Reference is made to FIG. 9. FIG. 9 is a perspective view of the main transport mechanism T₁. The main transport mechanism T₁ has two guide rails 51 for providing vertical guidance, and a guide rail 52 for providing horizontal guidance. The vertical guide rails 51 are fixed opposite each other at one side of the transporting space A₁. In this embodiment, the vertical guide rails 51 are arranged at the side adjacent the coating units 31. The horizontal guide rail 52 is slidably attached to the vertical guide rails 51. The horizontal guide rail 52 has a base 53 slidably attached thereto. The base 53 extends transversely, substantially to the center of the transporting space A₁. Further, drive members (not shown) are provided for vertically moving the horizontal guide rail 52, and horizontally moving the base 53. The drive members are operable to move the base 53 to positions for accessing the coating units 31 and heat-treating units 41 arranged vertically and horizontally.

The base 53 has a turntable 55 rotatable about a vertical axis Q. The turntable 55 has two holding arms 57 a and 57 b horizontally movably attached thereto for holding wafers W, respectively. The two holding arms 57 a and 57 b are arranged vertically close to each other. Further, drive members (not shown) are provided for rotating the turntable 55, and moving the holding arms 57 a and 57 b. The drive members are operable to move the turntable 55 to positions opposed to the coating units 31, heat-treating units 41 and receivers PASS₁ and PASS₂, and to extend and retract the holding arms 57 a and 57 b to and from the coating units 31 and so on.

[Third Cell 13]

The third cell 13 will be described next. Like reference numerals are used to identify like parts which are the same as in the first cell 11, and will not be described again. The layout in plan view of the main transport mechanism T₃ and treating units in the third cell 13 is substantially the same as in the first cell 11. It can be said, therefore, that the coating units 31 are vertically stacked over the different stories of the first cell 11 and third cell 13. Similarly, it can be said that the heat-treating units 41 also are vertically stacked over the different stories. The arrangement of the various treating units of the third cell 13 as seen from the main transport mechanism T₃ is substantially the same as the arrangement of the various treating units of the first cell 11 as seen from the main transport mechanism T₁.

In the following description, when distinguishing the resist film coating units RESIST in the first and third cells 11 and 13, subscripts “1” and “3” will be affixed (for example, the resist film coating units RESIST in the first cell 11 will be referred to as “resist film coating units RESIST₁”).

[First Cell 11 and Third Cell 13]

Reference is made to FIG. 4. Constructions relevant to the first cell 11 and third cell 13 will be described collectively. The receiver PASS₁ is disposed between the ID section 1 and first cell 11. The receiver PASS₃ is disposed between the ID section 1 and third cell 13. The receivers PASS₁ and PASS₃ are arranged in plan view at the ends of the transporting spaces A₁ and A₃ adjacent the ID section 1, respectively. Seen in a sectional view, the receiver PASS₁ is disposed at a height adjacent a lower part of the main transport mechanism T₁, while the receiver PASS₃ is disposed at a height adjacent an upper part of the main transport mechanism T₃. Therefore, the positions of receiver PASS₁ and receiver PASS₃ are close to each other for allowing the ID's transport mechanism T_(ID) to access the receiver PASS₁ and receiver PASS₃ using only a small amount of vertical movement.

Each of the receiver PASS₁ and receiver PASS₃ includes a plurality of (two) receivers arranged one over the other. Of the two receivers PASS₁, one PASS_(1A) serves to pass wafers W from the ID's transport mechanism T_(ID) to the main transport mechanism T₁, and the wafers W are deposited on the receiver PASS_(1A) solely by the ID's transport mechanism T_(ID). The other receiver PASS_(1B) serves to pass wafers W from the main transport mechanism T₁ to the ID's transport mechanism T_(ID), and the wafers W are deposited on the receiver PASS_(1B) solely by the main transport mechanism T₁. Each of the receivers PASS₂, PASS₄, PASS₅ and PASS₆ described hereinafter similarly includes two receivers used for transferring wafers W in opposite directions.

The receiver PASS₂ is disposed between the first cell 11 and second cell 12. The receiver PASS₄ is disposed between the third cell 13 and fourth cell 14. The receivers PASS₂ and PASS₄ are arranged in the same position in plan view. Buffers for temporarily storing wafers W and heat-treating units for heat-treating wafers W (neither being shown) are arranged in appropriate positions above and below the receivers PASS₂ and PASS₄.

Each of the transporting spaces A₁ and A₃ has a first blowout unit 61 for blowing out a clean gas, and an exhaust unit 62 for sucking the gas. Each of the first blowout unit 61 and exhaust unit 62 is in the form of a flat box having substantially the same area as the transporting space A₁ in plan view. Each of the first blowout unit 61 and exhaust unit 62 has first blowout openings 61 a or exhaust openings 62 a formed in one surface thereof. In this embodiment, the first blowout openings 61 a or exhaust openings 62 a are in the form of numerous small bores f. The first blowout units 61 are arranged over the transporting spaces A₁ and A₃ with the first blowout openings 61 a directed downward. The exhaust units 62 are arranged under the transporting spaces A₁ and A₃ with the exhaust openings 62 a directed upward. The atmosphere in the transporting space A₁ and the atmosphere in the transporting space A₃ are blocked off by the exhaust unit 62 of the transporting space A₁ and the first blowout unit 61 of the transporting space A₃. The first blowout openings 61 a correspond to the gas supply ports in this embodiment. The exhaust openings 62 a correspond to the gas exhaust ports in this embodiment. The first blowout units 61 correspond to the blowout units in this embodiment.

Referring to FIG. 5, the first blowout units 61 of the transporting spaces A₁ and A₃ are connected to a common, first gas supply pipe 63. The first gas supply pipe 63 extends laterally of the receivers PASS₂ and PASS₄ from an upper position of the transporting space A₁ to a lower position of the transporting space A₃, and is bent below the transporting space A₃ to extend horizontally. The other end of the first gas supply pipe 63 is connected to a gas source not shown. Similarly, the exhaust units 62 of the transporting spaces A₁ and A₃ are connected to a common, first gas exhaust pipe 64. The first gas exhaust pipe 64 extends laterally of the receivers PASS₂ and PASS₄ from a lower position of the transporting space A₁ to a lower position of the transporting space A₃, and is bent below the transporting space A₃ to extend horizontally. As the gas is blown out of each first blowout opening 61 a and sucked and exhausted through each exhaust opening 62 a of the transporting spaces A₁ and A₃, gas currents are formed to flow from top to bottom of the transporting spaces A₁ and A₃, thereby keeping each of the transporting spaces A₁ and A₃ in a clean state.

Each coating unit 31 of the first and third cells 11 and 13 has a pit portion PS extending vertically. The pit portion PS accommodates a second gas supply pipe 65 extending vertically for supplying the clean gas, and a second gas exhaust pipe 66 extending vertically for exhausting the gas. Each of the second gas supply pipe 65 and second gas exhaust pipe 66 branches at a predetermined height in each coating unit 31 to extend substantially horizontally from the pit portion PS. A plurality of branches of the second gas supply pipe 65 are connected to second blowout units 67 for blowing out the gas downward. A plurality of branches of the second gas exhaust pipe 66 are connected for communication to the bottoms of the respective cups 33. The other end of the second gas supply pipe 65 is connected to the first gas supply pipe 63 below the third cell 13. The other end of the second gas exhaust pipe 66 is connected to the first gas exhaust pipe 64 below the third cell 13. As the gas is blown out of the second blowout units 67 and exhausted through the second exhaust pipes 62 a, the atmosphere inside each cup 33 is constantly maintained clean, thereby allowing for excellent treatment of the wafer W held by the spin holder 32.

The pit portions PS further accommodate piping of the treating solutions, electric wiring and the like (not shown). Thus, with the pit portions PS accommodating the piping and electric wiring provided for the coating units 31 of the first and third cells 11 and 13, the piping and electric wiring can be reduced in length.

The main transport mechanisms T₁ and T₃ and treating units of the first cell 11 and third cell 13 are mounted in one housing 75. (See FIG. 4). This housing 75 defines one treating block Ba. The treating block Ba integrating the first cell 11 and third cell 13 corresponds to the coating block in this embodiment. Similarly, the main transport mechanisms T₂ and T₄ and treating units of the second cell 12 and fourth cell 14 described hereinafter are mounted in a different housing 75. This housing 75 defines another treating block Bb. The treating block Bb integrating the second cell 12 and fourth cell 14 corresponds to the developing block in this embodiment. Thus, with the housings 75 defining the treating blocks Ba and Bb integrating the cells arranged vertically, the treating section 3 may be manufactured and assembled simply.

[Second Cell 12]

The second cell 12 will be described next. Like reference numerals are used to identify like parts which are the same as in the first cell 11 and will not be described again. The second cell 12 has a transporting space A₂ formed as an extension of the transporting space A₁.

The treating units of the second cell 12 are developing units DEV for developing wafers W, heat-treating units 42 for heat-treating the wafers W, and an edge exposing unit EEW for exposing peripheral regions of the wafers W. The developing units DEV are arranged at one side of the transporting space A₂, and the heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A₂. Preferably, the developing units DEV are arranged at the same side as the coating units 31. It is also preferable that the heat-treating units 42 and edge exposing unit EEW are arranged in the same row as the heat-treating units 41.

In one embodiment, the number of developing units DEV is four, and sets of two units DEV arranged horizontally along the transporting space A₂ are stacked one over the other. Each developing unit DEV includes a spin holder 77 for holding and spinning a wafer W, and a cup 79 surrounding the wafer W. The two developing units DEV arranged at the lower level are not separated from each other by a partition wall or the like. A supply device 81 is provided for supplying developers to the two developing units DEV. The supply device 81 includes two slit nozzles 81 a having a slit or a row of small bores for delivering the developers. The slit or row of small bores, preferably, has a length corresponding to the diameter of wafer W. Preferably, the two slit nozzles 81 a are arranged to deliver developers of different types or concentrations. The supply device 81 further includes a moving mechanism 81 b for moving each slit nozzle 81 a. Thus, the slit nozzles 81 a are movable, respectively, over the two spin holders 77 juxtaposed sideways.

The plurality of heat-treating units 42 are arranged sideways along the transporting space A₂, and stacked one over the other. Each heat-treating unit 42 includes a heating unit HP for heating wafers W and a cooling unit CP for cooling wafers W.

The single edge exposing unit EEW is disposed in a predetermined position. The edge exposing unit EEW includes a spin holder (not shown) for holding and spinning a wafer W, and a light emitter (not shown) for exposing edges of the wafer W held by the spin holder.

The receiver PASS₅ and heating and cooling units PHP are stacked in a position facing the transporting space A₂ and adjacent the IF section 5. The stack of receiver PASS₅ and heating and cooling units PHP has one side thereof located adjacent one of the heat-treating units 42, and is aligned with the heat-treating units 42. As distinct from the heat-treating units 42 of the second cell 12, the heating and cooling units PHP rely on the IF's transport mechanism TIF for transport of wafers W. In terms of layout, the heating and cooling units PHP are mounted in the same housing 75 as the second and fourth cells 12 and 14. These heating and cooling units PHP and receiver PASS₅ are constructed for allowing wafers W to be loaded and unloaded through the front thereof opposed to the transporting space A₂ and the side opposed to the IF section 5.

The main transport mechanism T₂ is disposed substantially centrally of the transporting space A₂ in plan view. The main transport mechanism T₂ has the same construction as the main transport mechanism T₁. The main transport mechanism T₂ transports wafers W to and from the receiver PASS₂, various heat-treating units 42, edge exposing unit EEW and receiver PASS₅.

[Fourth Cell 14]

Like reference numerals are used to identify like parts which are the same as in the first and second cells 11 and 12, and will not be described again. The layout in plan view of the main transport mechanism T₄ and treating units in the fourth cell 14 is substantially the same as that of the second cell 12. The arrangement of the various treating units of the fourth cell 14 as seen from the main transport mechanism T₄ is substantially the same as the arrangement of the various treating units of the second cell 12 as seen from the main transport mechanism T₂. Thus, the developing units DEV of the second cell 12 and fourth cell 14 are stacked vertically. Similarly, the heat-treating units 42 of the second cell 12 and fourth cell 14 are stacked vertically.

[Second Cell 12 and Fourth Cell 14]

Constructions relevant to the second cell 12 and fourth cell 14 also are substantially the same as the constructions relevant to the first cell 11 and third cell 13, and will be described briefly. Each of the transporting spaces A₂ and A₄ of the second and fourth cells 12 and 14 also has constructions corresponding to the first blowout unit 61 and exhaust unit 62. Each developing unit DEV of the second and fourth cells 12 and 14 also has constructions corresponding to the second blowout unit 67 and second gas exhaust pipe 66.

In the following description, when distinguishing the developing units DEV, edge exposing units EEW, and so on in the second and fourth cells 12 and 14, subscripts “2” and “4” will be affixed (for example, the heating units HP in the second cell 12 will be referred to as “heating units HP2”).

[IF Section 5, etc.]

Reference is now made to FIG. 1 and FIG. 7. The first transport mechanism T_(IFA) and second transport mechanism TIFB are arranged in a direction perpendicular to the arrangement of cells 11 and 12 (13 and 14). The first transport mechanism T_(IFA) is disposed at the side where the heat-treating units 42 and so on of the second and fourth cells 12 and 14 are located. The second transport mechanism T_(IFB) is disposed at the side where the developing units DEV of the second fourth cells 12 and 14 are located. Stacked in multiples stages between the first and second transport mechanisms T_(IFA) and T_(IFB) are a receiver PASS-CP for receiving and cooling wafers W, a receiver PASS₇ for receiving wafers W, and buffers BF for temporarily storing wafers W.

The first transport mechanism T_(IFA) includes a fixed base 83, lift shafts 85 vertically extendible and contractible relative to the base 83, and a holding arm 87 swivelable on the lift shafts 85, and extendible and retractable radially of the swivel motion, for holding a wafer W. The first transport mechanism TIFA transports wafers W between the heating and cooling units (PHP₂, PHP₄), receivers (PASS₅, PASS₆, PASS-CP) and buffers BF. The second transport mechanism T_(IFB) also has a base 83, lift shafts 85 and a holding arm 87 for transporting wafers W between the receivers (PASS-CP, PASS₇) and exposing machine EXP.

A control system of this apparatus will be described next. FIG. 10 is a control block diagram of the substrate treating apparatus according to the embodiment. As shown, this apparatus includes a main controller 91 and a first to a sixth controllers 93, 94, 95, 96, 97 and 98.

The first controller 93 controls substrate transport by the ID's transport mechanism T_(ID). The second controller 94 controls substrate transport by the main transport mechanism T₁, and substrate treatment in the resist film coating units RESIST₁, antireflection film coating units BARC₁, cooling units CP₁, heating and cooling units PHP₁ and adhesion units AHL₁. The third controller 95 controls substrate transport by the main transport mechanism T₂, and substrate treatment in the edge exposing unit EEW₂, developing units DEV₂, heating units HP₂ and cooling units CP₂. The controls by the fourth and fifth controllers 96 and 97 correspond to those by the second and third controllers 94 and 95, respectively. The sixth controller 98 controls substrate transport by the first and second transport mechanisms T_(IFA) and _(TIFB,) and substrate treatment in the heating and cooling units PHP₂ and PHP₄. The first to sixth controllers 93-98 carry out the controls independently of one another.

The main controller 91 performs overall control of the first to sixth controllers 93-98. Specifically, the main controller 91 controls coordination among the transport mechanisms. For example, the main controller 91 adjusts the timing of the respective transport mechanisms making access to the receivers PASS₁-PASS₆. The main controller 91 also controls wafers W to be transported to the exposing machine EXP in the order in which the wafers W are fetched from the cassettes C.

Each of the main controller 91 and the first to sixth controllers 93-98 is realized by a central processing unit (CPU) which performs various processes, a RAM (Random Access Memory) used as the workspace for operation processes, and a storage medium such as a fixed disk for storing a variety of information including a predetermined processing recipe (processing program). The main controller 91 and the first to sixth controllers 93-98 correspond to the controller in this embodiment.

Next, operation of the substrate treating apparatus in this embodiment will be described. FIG. 11 is a flow chart of a series of treatments of wafers W, indicating the treating units and receivers to which the wafers W are transported in order. FIG. 12 is a view schematically showing operations repeated by each transport mechanism, and specifying an order of treating units, receivers and cassettes accessed by the transport mechanisms. The following description will be made separately for each transport mechanism.

[ID's Transport Mechanism T_(ID)]

The ID's transport mechanism T_(ID) moves to a position opposed to one of the cassettes C, holds with the holding arm 25 a wafer W to be treated and takes the wafer W out of the cassette C. The ID's transport mechanism T_(ID) swivels the holding arm 25, vertically moves the lift shaft 23, moves to a position opposed to the receiver PASS₁, and places the wafer Won the receiver PASS_(1A) (which corresponds to step S1a in FIG. 11; only step numbers will be indicated hereinafter). At this time, a wafer W usually is present on the receiver PASS_(1B), and the ID's transport mechanism T_(ID) receives this wafer W and stores it in a cassette C (step S23). When there is no wafer W on the receiver PASS_(1B) the ID's transport mechanism T_(ID) just accesses the cassette C. Then, the ID's transport mechanism T_(ID) transports a wafer W from the cassette C to the receiver PASS_(3A) (step S1b). Here again, if a wafer W is present on the receiver PASS_(3B), the ID's transport mechanism T_(ID) will store this wafer W in a cassette C (step S23).

The ID's transport mechanism T_(ID) repeats the above operation. This operation is controlled by the first controller 93. As a result, the wafers W taken out one at a time from the cassette C are transported alternately to the first cell 11 and third cell 13.

[Main Transport Mechanisms T₁, T₃]

Since operation of the main transport mechanism T₃ is substantially the same as operation of the main transport mechanism T₁, only the main transport mechanism T₁ will be described. The main transport mechanism T₁ moves to a position opposed to the receiver PASS₁. At this time, the main transport mechanism T₁ holds, on one holding arm 57 (e.g. 57 b), a wafer W received immediately before from the receiver PASS_(2B). The main transport mechanism Ti places this wafer W on the receiver PASS_(1B) (step S22), and holds the wafer W present on the receiver PASS_(1A) with the other holding arm 57 (e.g. 57 a).

The main transport mechanism T₁ accesses a predetermined one of the cooling units CP₁. There is a different wafer W having already received a predetermined heat treatment (cooling) in the cooling unit CP₁. The main transport mechanism T₁ holds the different wafer W with the unloaded holding arm 57 (holding no wafer W), takes it out of the cooling unit CP₁, and loads into the cooling unit CP₁ the wafer W having received from the receiver PASS_(1A). Then, the main transport mechanism T₁, holding the cooled wafer W, moves to one of the antireflection film coating units BARC₁. The cooling unit CP₁ starts heat treatment (cooling) of the wafer W loaded therein (step S2). It is assumed that, when the main transport mechanism T₁ subsequently accesses the different heat-treating units 41 and coating units 31, wafers W having received predetermined treatments are present in these treating units (31 and 41).

Accessing the antireflection film coating unit BARC₁, the main transport mechanism T₁ takes a wafer W having antireflection film formed thereon from the antireflection film coating unit BARC₁, and places the cooled wafer W on the spin holder 32 of the antireflection film coating unit BARC₁. Then, the main transport mechanism T₁, holding the wafer W having antireflection film formed thereon, moves to one of the heating and cooling units PHP₁. The antireflection film coating unit BARC₁ starts treatment of the wafer W placed on the spin holder 32 (step S3).

Specifically, the spin holder 32 spins the wafer W in horizontal posture, the gripper 26 grips one of the nozzles 35, the nozzle moving mechanism 37 moves the gripped nozzle 35 to a position above the wafer W, and the treating solution for antireflection films is supplied from the nozzle 35 to the wafer W. The treating solution supplied spreads all over the wafer W, and is scattered away from the wafer W. The cup 33 collects the scattering treating solution. In this way, the treatment is carried out for forming antireflection film on the wafer W.

Accessing the heating and cooling unit PHP₁, the main transport mechanism T₁ takes a wafer W having received heat treatment out of the heating and cooling unit PHP₁, and loads the wafer W having antireflection film formed thereon into the heating and cooling unit PHP₁. Then, the main transport mechanism T₁, holding the wafer W taken out of the heating and cooling unit PHP₁, moves to one of the cooling units CP_('). The heating and cooling unit PHP₁ receives a wafer W successively on the two plates 43, to heat the wafer W on one of the plates 43 and then to cool the wafer W on the other plate 43 (step S4).

Having moved to the cooling unit CP₁, the main transport mechanism T₁ takes a wafer W out of the cooling unit CP₁, and loads the wafer W held by the transport mechanism T₁ into the cooling unit CP₁. The cooling unit CP₁ cools the wafer W loaded therein (step S5).

Then, the main transport mechanism T₁ moves to one of the resist film coating units RESIST₁. The main transport mechanism T₁ takes a wafer W having resist film formed thereon from the resist film coating unit RESIST₁, and loads the wafer W held by the main transport mechanism T₁ into the resist film coating unit RESIST₁. The resist film coating unit RESIST₁ supplies the resist film material while spinning the wafer W loaded therein, to form resist film on the wafer W (step S6).

The main transport mechanism T₁ further moves to one of the heating and cooling units PHP₁ and one of the cooling units CP₁. The main transport mechanism T₁ loads the wafer W having resist film formed thereon into the heating and cooling unit PHP₁, transfers a wafer W treated in the heating and cooling unit PHP₁ to the cooling unit CP₁ , and receives a wafer W treated in the cooling unit CP₁. The heating and cooling unit PHP₁ and cooling unit CP₁ carry out predetermined treatments of newly loaded wafers W, respectively (steps S7 and S8).

The main transport mechanism T₁ moves to the receiver PASS₂, places the wafer W it is holding on the receiver PASS_(2A) (step S9), and receives a wafer W present on the receiver PASS_(2B) (step S21).

Subsequently, the main transport mechanism T₁ accesses the receiver PASS₁ again, and repeats the above operation. This operation is controlled by the second controller 94. Having received a wafer W from the receiver PASS₁, the main transport mechanism T₁ transports this wafer W to a predetermined treating unit (a cooling unit CP₁ in this embodiment), and takes a treated wafer W from this treating unit. Subsequently, the main transport mechanism T₁ moves to a plurality of treating units in order, and transfers wafers W treated in the respective treating units to other treating units. Whenever a treated wafer W is replaced by a wafer W to be treated, each treating unit (31, 41) starts the predetermined treatment. Thus, predetermined treatments are carried out in parallel for a plurality of wafers W in the respective treating units. A series of treating steps is successively performed for a plurality of wafers W. In these circumstances, the second controller 94 controls periods of the series of treating steps to be uniform. Further, it is preferred to control the timing of transporting wafers W to each treating unit (31, 41) and a schedule of treatment carried out in each treating unit (31, 41) to be uniform between the wafers W. As a result, the series of treatments is completed in order, starting with a wafer W first placed on the receiver PASS₁. The wafers W are forwarded to the receiver PASS₂ in the order in which they are placed on the receiver PASS₁. Similarly, the main transport mechanism T₁ places the wafers W on the receiver PASS₁ in the order of receipt from the receiver PASS₂.

[Main Transport Mechanisms T₂, T₄]

Since operation of the main transport mechanism T₄ is substantially the same as operation of the main transport mechanism T₂, only the main transport mechanism T₂ will be described. The main transport mechanism T₂ moves to a position opposed to the receiver PASS₂. At this time, the main transport mechanism T₂ holds a wafer W received from a cooling unit CP₂ accessed immediately before. The main transport mechanism T₂ places this wafer W on the receiver PASS_(2B) (step S21), and holds the wafer W present on the receiver PASS_(2A) (step S9).

The main transport mechanism T₂ accesses the edge exposing unit EEW₂. The main transport mechanism T₂ receives a wafer W having received a predetermined treatment in the edge exposing unit EEW₂, and loads the cooled wafer W into the edge exposing unit EEW₂. While spinning the wafer W loaded therein, the edge exposing unit EEW₂ irradiates peripheral regions of the wafer W with light from the light emitter not shown, thereby exposing the peripheral regions of the wafer W (step S10).

The main transport mechanism T₂, holding the wafer W received from the edge exposing unit EEW₂, accesses the receiver PASS₅. The main transport mechanism T₂ places the wafer W on the receiver PASS_(5A) (step S11), and holds a wafer W present on the receiver PASS_(5B) (step S16).

The main transport mechanism T₂ moves to one of the cooling units CP₂, and replaces a wafer W in the cooling unit CP₂ with the wafer W held by the main transport mechanism T₂. The main transport mechanism T₂ holds the wafer W having received cooling treatment, and accesses one of the developing units DEV₂. The cooling unit CP₂ starts treatment of the newly loaded wafer W (step S17).

The main transport mechanism T₂ takes a developed wafer W from the developing unit DEV₂, and places the cooled wafer W on the spin holder 77 of the developing unit DEV₂. The developing unit DEV₂ develops the wafer W placed on the spin holder 77 (step S18). Specifically, while the spin holder 77 spins the wafer W in horizontal posture, the developer is supplied from one of the slit nozzles 81 a to the wafer W, thereby developing the wafer W.

The main transport mechanism T₂ holds the developed wafer W, and accesses one of the heating units HP₂. The main transport mechanism T₂ takes a wafer W out of the heating unit HP₂, and loads the wafer W it is holding into the heating unit HP₂. Then, the main transport mechanism T₂ transports the wafer W taken out of the heating unit HP₂ to one of the cooling units CP₂, and takes out a wafer W already treated in this cooling unit CP₂. The heating unit HP₂ and cooling unit CP₂ carry out predetermined treatments for the newly loaded wafers W, respectively (steps S19 and S20).

Subsequently, the main transport mechanism T₂ accesses the receiver PASS₂ again, and repeats the above operation. This operation is controlled by the third controller 95. As a result, the wafers W are forwarded to the receiver PASS_(5B) in the order in which they are placed on the receiver PASS_(2A). Similarly, the wafers W are forwarded to the receiver PASS_(SB) in the order in which they are placed on the receiver PASS_(5B).

[IF's Transport Mechanisms T_(IF)-First Transport Mechanism T_(IFA)]

The first transport mechanism T_(IFA) accesses the receiver PAS S₅, and receives the wafer W present on the receiver PASS_(5A) (step S11a). The first transport mechanism T_(IFA), holding the wafer W received, moves to the receiver PASS-CP, and loads the wafer W on the receiver PASS-CP (step S12).

Next, the first transport mechanism T_(IFA) receives a wafer W from the receiver PASS₇ (step S14), and moves to a position opposed to one of the heating and cooling units PHP₂. The first transport mechanism T_(IFA) takes a wafer W having received heat treatment (PEB: Post Exposure Bake) from the heating and cooling unit PHP₂, and loads the wafer W received from the receiver PASS7 into the heating and cooling unit PHP₂. The heating and cooling unit PHP₂ carries out heat treatment for the newly loaded wafer W (step S15).

The first transport mechanism T_(IFA) transports the wafer W taken out of the heating and cooling unit PHP₂ to the receiver PASS_(5B). Subsequently, the first transport mechanism T_(IFA) transports a wafer W from the receiver PASS_(6A) to the receiver PASS-CP (Step S11b, 12). Next, the first transport mechanism T_(IFA) transports a wafer W from the receiver PASS₇ to one of the heating and cooling units PHP₄. At this time, the first transport mechanism T_(IFA) takes out a wafer W having been treated in the heating and cooling unit PHP₄, and places the wafer W on the receiver PASS_(6B).

Subsequently, the first transport mechanism T_(IFA) accesses the receiver PASS₅ again and repeats the above operation. This operation is controlled by the sixth controller 98. By transporting wafers W alternately from the receivers PASS₅ and PASS₆ to the receiver PASS-CP, the wafers W are placed on the receiver PASS-CP in the order in which the ID's transport mechanism TID has taken them out of the cassette C.

However, the controls of transport to and from the treating units by the main transport mechanisms T and treatment in the treating units are carried out independently for each of the cells 11-14. That is, no adjustment is made to the timing of feeding wafers W to each of the receiver PASS₅ and receiver PASS₆. Therefore, the order of feeding wafers W to the receiver PASS₅ and receiver PASS₆ may not agree with the order in which they are taken out of the cassette C due to a fault such as a delay in substrate treatment or transportation. In such a case, the sixth controller 98 operates the first transport mechanism T_(IFA) as follows.

When wafers W fail to be fed to either one of the receiver PASS_(5A) and receiver PASS_(6A), and wafers W are placed on the other receiver, the wafers W placed on the other receiver is transported to the buffers BF instead of the receiver PASS-CP. When wafers W begin to be placed again on the receiver for which the feeding has been disrupted, the wafers W are transported from the receiver now restored to service to the receiver PASS-CP, and also from the buffers BF to the receiver PASS-CP. At this time, the wafers W are transported alternately from the restored receiver and buffers BF to the receiver PASS-CP. As a result, even when the order of feeding wafers W to the receiver PASS₅ and receiver PASS₆ disagrees with the order in which they are taken out of the cassette C, the order of wafers W transported to the receiver PASS-CP is in agreement with the order of wafers W taken out of the cassette C.

[IF's Transport Mechanisms T_(IF)-Second Transport Mechanism T_(IFB)]

The second transport mechanism T_(IFB) takes a wafer W out of the receiver PASS-CP, and transports it to the exposing machine EXP. Then, the second transport mechanism T_(IFB) receives an exposed wafer W from the exposing machine EXP, and transports it to the receiver PASS₇.

Subsequently, the second transport mechanism T_(IFB) accesses the receiver PASS-CP again and repeats the above operation. This operation also is controlled by the sixth controller 98. As described above, the first and second transport mechanisms T_(IFA) and T_(IFB) cooperate to feed wafers W to the exposing machine EXP in the order in which they are taken out of the cassette C.

The substrate treating apparatus according to this embodiment has two substrate treatment lines Lu and Ld arranged one over the other. This construction can substantially double the processing capabilities in the treatment for forming antireflection film and resist film and in the treatment for developing wafers W. Therefore, the throughput of the substrate treating apparatus is improved drastically.

Each of the substrate treatment lines Lu and Ld includes the main transport mechanisms T arranged in one row. This arrangement can inhibit an increase in the installation area of the treating section 3.

The arrangements of the main transport mechanisms T₁ and T₃ (T₂ and T₄) and treating units in the two, upper and lower, substrate treatment lines Lu (Ld) are substantially the same in plan view, which can simplify the construction of the apparatus.

The construction of the apparatus may be simplified by providing the same type of treating units for the two, upper and lower, substrate treatment lines Lu and Ld to perform the same series of treatments.

The treating units of the upper and lower cells 11 and 13 (12, 14) are stacked together. This arrangement can simplify the construction of treating blocks Ba and Bb each including two, upper and lower cells.

Each of the treating blocks Ba and Bb has a housing 75 which collectively supports the two, upper and lower, main transport mechanisms T and the plurality of treating units. This allows the substrate treating apparatus to be manufactured efficiently and to be maintained and repaired easily.

Each of the transporting spaces A₁-A₄ has the first blowout openings 61 a and discharge openings 62 a, which can keep each transporting space A clean.

The first blowout openings 61 a are arranged over each transporting space A, and the discharge openings 62 a under each transporting space A, to produce substantially vertical, downward gas currents in the transporting space A. This prevents the temperature environment of transporting spaces A, coating units 31 and developing units DEV from being influenced by the heat from the heat-treating units 41.

The exhaust unit 62 provided in the transporting space A₁ (A₂) and the first blowout unit 61 provided in the transporting space A₃ (A₄) block off the atmospheres of each of the transporting spaces A₁ and A₃ (A₂ and A₄). Thus, each transporting space A can be maintained clean. The apparatus construction is simplified since no special or additional component is required for blocking off atmosphere.

The first gas supply pipe 61 is provided as a component common to the first blowout units 61 of the upper and lower transporting spaces A₁ and A₃. This reduces piping installation space and simplifies the apparatus construction.

The receivers PASS₁ and PASS₃ are provided for transferring wafers W between the ID's transport mechanism T_(ID) and main transport mechanisms T₁ and T₃, which can prevent lowering of the transporting efficiency of the ID's transport mechanism T_(ID) and main transport mechanisms T₁ and T₃. Similarly, the transporting efficiency of each transport mechanism is prevented from lowering by transferring wafers W between the transport mechanisms through the receivers PASS.

Since the receiver PASS₁ and receiver PASS₃ are locate close to each other, the ID's transport mechanism T_(ID) can access the receiver PASS₁ and receiver PASS₃ through a reduced amount of vertical movement.

The main controller 91 and the first to sixth controllers 93-98 are provided to control movement of wafers W to bring into agreement the order of fetching from a cassette C and the order of feeding to the exposing machine EXP. This enables supervision or follow-up check of each wafer W without providing a construction for identifying the wafers W.

The common, second gas supply pipe 65 is provided for the coating units 31 (developing units DEV) in the upper and lower cells 11 and 13 (12 and 14). This reduces piping installation space and simplifies the apparatus construction.

This invention is not limited to the foregoing embodiment, but may be modified as follows:

(1) The foregoing embodiment provides two substrate treatment lines Lu and Ld, but the invention not limited to this. The construction may be modified to include three or more substrate treatment lines vertically arranged in multiple stages.

(2) In the foregoing embodiment, each substrate treatment line Lu (Ld) has two cells 11 and 12 (13 and 14) connected to each other. The invention is not limited to this. Each substrate treatment line may have three or more cells.

(3) In the foregoing embodiment, the substrate treatment lines Lu and Ld carry out the treatment for forming resist film and antireflection film on the wafers W, and the treatment for developing exposed wafers W. The substrate treatment lines may be modified to perform other treatment such as cleaning of the wafers W. Accordingly, the type, number and the like of treating units are selected or designed as appropriate. Further, the substrate treating apparatus may be constructed to exclude the IF section 5.

(4) In the foregoing embodiment, the two substrate treatment lines Lu and Ld perform the same series of treatments. Instead, the substrate treatment lines Lu and Ld may be modified to perform different treatments.

(5) In the foregoing embodiment, the two substrate treatment lines Lu and LD have substantially the same plane layout. Instead, each of the substrate treatment lines Lu and Ld (i.e. upper and lower cells) may have the main transport mechanisms T and treating units arranged differently.

(6) In the foregoing embodiment, the upper and lower cells 11 and 13 (12 and 14) have the same arrangement of treating units as seen from the main transport mechanisms T. Instead, the upper and lower cells may have different arrangements of treating cells.

(7) In the foregoing embodiment, each of the cells 11-14 has the treating units arranged at opposite sides of the transporting space A. Instead, the treating units may be arranged at only one side.

(8) In the foregoing embodiment, wafers W are transferred between the transport mechanisms through the receivers PASS. Instead, the wafers W may be transferred directly between the transport mechanisms, for example.

(9) The foregoing embodiment may be modified to include buffers BF and cooling units CP arranged over and/or under the receivers PASS₁, PASS₂, PASS₃ and PASS₄. This construction allows the wafers W to be stored temporarily or cooled as appropriate.

(10) In the foregoing embodiment, the IF transport mechanisms TIF include two transport mechanisms TIFA and TIFB. The IF section may be modified to include one transport mechanism or three or more transport mechanisms.

(11) The foregoing embodiment provides no partition or the like between the antireflection film coating unit BARC and resist film coating unit RESIST, but allows the atmosphere to be shared between these coating units. Instead, the atmospheres of the two units may be blocked off as appropriate.

(12) In the foregoing embodiment, one first blowout unit 61 and one exhaust unit 62 are constructed to block off the atmosphere of each of the transporting spaces A₁ and A₃ (A₂ and A₄). The invention is not limited to this. For example, only one of the first blowout unit 61 and exhaust unit 62 may block off atmosphere. Alternatively, a shielding plate may be provided separately from the first blowout unit 61 and exhaust unit 62 for blocking off the atmosphere of each of the upper and lower transporting spaces A.

(13) In the foregoing embodiment, the first blowout unit 61 is disposed over each transporting space A, and the exhaust unit 62 disposed under each transporting space. Instead, the first blowout unit 61 or exhaust unit 62 may be disposed laterally of each transporting space A. The first blowout unit 61 and exhaust unit 62 may be shared by the transporting spaces A₁ and A₂ (A₃ and A₄) of the same substrate treatment line Lu (Ld).

This invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof and, accordingly, reference should be made to the appended claims, rather than to the foregoing specification, as indicating the scope of the invention. 

1. A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section, the method comprising the steps of: performing resist film forming treatment in parallel on a plurality of stories provided in the treating section; and performing developing treatment in parallel on a plurality of stories provided in the treating section.
 2. The substrate treating method of claim 1, comprising the step executed in the indexer section of taking the substrates out of a cassette and transporting the substrates alternately to the respective stories on which the resist film forming treatment is performed.
 3. The substrate treating method of claim 1, comprising the step executed in the indexer section of receiving the substrates alternately from the respective stories on which the developing treatment is performed, and storing the substrates in a cassette.
 4. The substrate treating method of claim 1; wherein both the step of performing the resist film forming treatment and the step of performing the developing treatment are executed on each of the stories; the method further comprising the step executed in the indexer section of taking substrates out of a cassette, transporting the taken-out substrates alternately to the respective stories, and when transporting the substrates to the respective stories, receiving substrates alternately from the respective stories, and storing the received substrates in the cassette.
 5. The substrate treating method of claim 1, comprising the step executed in the interface section of receiving the substrates alternately from the respective stories on which the resist film forming treatment is performed, and transporting the substrates to an exposing machine provided as external apparatus.
 6. The substrate treating method of claim 1, comprising the step executed in the interface section of receiving the substrates from an exposing machine provided as external apparatus, and transporting the substrates alternately to the respective stories on which the developing treatment is performed.
 7. The substrate treating method of claim 1; wherein both the step of performing the resist film forming treatment and the step of performing the developing treatment are executed on each of the stories; the method further comprising the step executed in the interface section of receiving the substrates alternately from the respective stories, transporting the substrates to an exposing machine provided as external apparatus, receiving the substrates from the exposing machine, transporting the substrates to the respective stories, and when transporting the substrates to the respective stories, receiving the substrates from the respective stories.
 8. The substrate treating method of claim 1 wherein each of the stories for performing the resist film forming treatment of the substrates feeds the substrates to the interface section in an order in which the substrates are received from the indexer section.
 9. The substrate treating method of claim 1 wherein each of the stories for performing the developing treatment of the substrates feeds the substrates to the indexer section in an order in which the substrates are received from the interface section.
 10. The substrate treating method of claim 1 wherein controls for causing the respective stories to perform the resist film forming treatment of the substrates are independent of each other.
 11. The substrate treating method of claim 1 wherein controls for causing the respective stories to perform the developing treatment of the substrates are independent of each other.
 12. The substrate treating method of claim 1 wherein the step of performing the resist film forming treatment in parallel is executed to carry out a series of treating steps successively for the substrates, which treating steps include treatment for applying a resist film material to the substrates and treatment for heat-treating the substrates, periods of the series of treating steps being uniformed for the respective substrates.
 13. The substrate treating method of claim 1, comprising: the step executed in the indexer section of taking the substrates out of a cassette, and transporting the substrates to the respective stories on which the resist film forming treatment is performed; and the step executed in the interface section of receiving the substrates from the respective stories on which the resist film forming treatment is performed, and transporting the substrates to an exposing machine provided as external apparatus.
 14. The substrate treating method of claim 13 wherein the step of transporting the substrates to the exposing machine is executed to transport the substrates to the exposing machine in an order in which the substrates are taken out of the cassette.
 15. The substrate treating method of claim 13 wherein, when a difference occurs between the order of the substrates received by the interface section from the stories on which the resist film forming treatment is performed, and the order of the substrates taken out of the cassette in the indexer section, the substrates are placed on buffers to enable the interface section to receive succeeding substrates from the respective stories on which the resist film forming treatment is performed.
 16. The substrate treating method of claim 13 wherein, when the substrates fail to be fed to the interface section from part of the stories on which the resist film forming treatment is performed and the substrates are fed to the interface section from other of the stories, the interface section transports the substrates fed from the other of the stories to the buffers.
 17. The substrate treating method of claim 16 wherein, when the substrates begin to be fed again from the part of the stories having stopped feeding the substrates, the interface section transports the substrates fed from the part of the stories and the substrates placed on the buffers, alternately to the exposing machine. 